Introducing our high-quality Phenolic Insulation Board, made from phenolic foam material. Our Phenolic Board is a polymer organic hard aluminum foil foam product that is created by foaming thermosetting phenolic resin. Widely used for insulation purposes, our Phenolic Board has a high closed-cell rate, which results in a low thermal conductivity coefficient (can be less than 0.030W/MK). This means that it has excellent insulation properties and is resistant to water and water vapor permeability. It is an ideal material for insulation and energy-saving purposes, and is particularly useful in HVAC systems.
The Phenolic Board is also dimensionally stable, with a variation rate of less than 1%. This is due to its benzene ring structure, which ensures that it is chemically stable and does not easily age. It is resistant to organic solvents, strong acids, and weak alkalis, making it a durable and long-lasting insulation material.
Our Phenolic Insulation Board is widely used in cold storage facilities, where its excellent insulation properties and resistance to water and water vapor make it an ideal choice. Trust in our Phenolic Board to provide superior insulation and energy-saving capabilities for your next project.
ITEM | INDEX | ITEM | INDEX |
Name | Aluminum Foil Laminated Phenolic Board | Wind resistance strength | ≤1500 Pa |
Material | Aluminum Foil, Phenolic Foam, Non-woven fabric | Compression strength | ≥0.18 MPa |
Conventional thickness | 20mm, 25mm, 30mm | Bending strength | ≥1.1 MPa |
Length/Width (mm) | 2000x1200, 3000x1200, 4000x1200 | Leakage air volume | ≤ 1.2% |
Fireproof rating | UL181/ASTM/BS476 PART6&7/A2 | Thermal resistance | 0.86 m2K/W |
Density of core material | 60-70kg/m3 | Smoke density | ≤9, no toxic gas release |
Water absorption | ≤3.7% | Dimension stability | ≤2% (70±2℃, 48h) |
Thermal conductivity | 0.019-0.02 W(mK) | Oxygen index | ≥45 |
Heat resistance | -150 ~ +150℃ | Duration of fire resistance | >1.5h |
Air flow max | 15M/s | Formaldehyde Emission | ≤0.5Mg/L |