Introducing our high-quality Phenolic Insulation Board, made from phenolic foam material which is a type of high molecular organic hard aluminum foil foam product. This product is created by foaming thermosetting phenolic resin, resulting in a durable and reliable insulation material that is widely used in various applications.
With a high closed-cell ratio, our Phenolic Insulation Board boasts a low thermal conductivity of less than 0.030W/MK, providing excellent insulation performance and resistance to water and vapor penetration. This makes it an ideal material for energy-saving insulation and HVAC engineering applications.
Thanks to its stable benzene ring structure, our Phenolic Insulation Board has a dimensionally stable design with a change rate of less than 1%. Additionally, its chemical composition is highly stable, making it resistant to aging and corrosion from organic solvents, strong acids, and weak alkalis.
Our Phenolic Insulation Board is widely used in cold storage facilities and is an excellent choice for insulation and energy-saving applications. Trust our high-quality product to provide reliable and long-lasting insulation for your needs.
| ITEM | INDEX | ITEM | INDEX |
| Conventional thickness | 20mm, 25mm, 30mm | Bending strength | ≥1.1 MPa |
| Length/Width (mm) | 2000x1200, 3000x1200, 4000x1200 | Leakage air volume | ≤ 1.2% |
| Fireproof rating | A2 | Thermal resistance | 0.86 m2K/W |
| Density of core material | 60-70kg/m3 | Smoke density | ≤9, no toxic gas release |
| Water absorption | ≤3.7% | Dimension stability | ≤2% (70±2℃, 48h) |
| Thermal conductivity | 0.019-0.02 W(mK) | Oxygen index | ≥45 |
| Heat resistance | -150 ~ +150℃ | Duration of fire resistance | >1.5h |
| Wind resistance strength | ≤1500 Pa | Formaldehyde Emission | ≤0.5Mg/L |
| Compression strength | ≥0.18 MPa | Air flow max | 15M/s |